Wafer scale integration, III

SubTitle :

Proceedings of the Third IFIP WG 10.5 Workshop on Wafer Scale Integration, Como, Italy, 6-8 June 1989

Collation :

ix, 402 P.: Illus

Addition :

Title :

Wafer scale integration, III

LC Class :

621

LC Number :

.3815

LC CutterNumber :

I 23 W

تاريخ ورود اطلاعات :

/ /

Publication Year :

1990

LC Date :

1990

Publication :

North-Holland

Subject :

Integrated circuits- Wafer scale integration- Congresses

Editor :

Edited by Mariagiovanna Sami, Fausto Distante

DocumentNumber :

636

ISBNN :

Link To Document :